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TDA8006 Datasheet, PDF (29/40 Pages) NXP Semiconductors – Multiprotocol IC Card coupler
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Philips Semiconductors
Multiprotocol IC Card coupler
Product specification
TDA8006
SYMBOL
PARAMETER
Crystal oscillator
fxtal
crystal frequency
fext
frequency of external signal
applied on pin XTAL1
CLKOUT
fCLKOUT
VOL
VOH
to(r)
to(f)
δ
frequency on pin CLKOUT
LOW-level output voltage
HIGH-level output voltage
output rise time
output fall time
duty factor
Step-up converter
fINT
internal oscillation frequency
VVUP
voltage on pin VUP
Reset output to the card (pin RST)
Vo(RST)
output voltage
Io(RST)
VOL
VOH
tr
tf
output current
LOW-level output voltage
HIGH-level output voltage
rise time
fall time
Clock output to the card (pin CLK)
Vo(CLK)
output voltage
Io(CLK)
VOL
VOH
tr
tf
fCLK
output current
LOW-level output voltage
HIGH-level output voltage
rise time
fall time
clock frequency
δ
duty factor
SR
slew rate (rise and fall)
CONDITIONS
MIN. TYP. MAX.
4
−
25
0
−
25
IOL = 5 mA
IOH = −5 mA
CL = 60 pF
CL = 60 pF
CL = 60 pF
0
−
25
−
−
0.8
VDD − 1 −
−
−
−
10
−
−
10
40
−
60
2
2.5 3
−
6.5 −
inactive mode; no load
0
−
0.1
inactive mode; Io(RST) = 1 mA
0
−
0.3
when inactive and pin grounded 0
−
−1
IOL = 200 µA
0
−
0.3
IOH = −200 µA
VCC − 0.7 −
VCC
CL = 30 pF
−
−
0.1
CL = 30 pF
−
−
0.1
inactive mode; no load
0
−
0.1
inactive mode; Io(CLK) = 1 mA
0
−
0.3
when inactive and pin grounded 0
−
−1
IOL = 200 µA
0
−
0.3
IOH = −200 µA
VCC − 0.5 −
VCC
CL = 30 pF
−
−
8
CL = 30 pF
−
−
8
1.25 MHz idle configuration
1
1.25 1.5
operational
0
−
10
CL = 30 pF
45
−
55
CL = 30 pF
0.2
−
−
UNIT
MHz
MHz
MHz
V
V
ns
ns
%
MHz
V
V
V
mA
V
V
µs
µs
V
V
mA
V
V
ns
ns
MHz
MHz
%
V/ns
2000 Feb 21
29
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