SAB9076H Datasheet, PDF (29/32 Pages) NXP Semiconductors – Picture-In-Picture PIP controller

Philips Semiconductors
Picture-In-Picture (PIP) controller
Preliminary specification
SAB9076H
PACKAGE OUTLINE
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
c
y
X
80
81
51
A
50
ZE
100
1
pin 1 index
wM
e
b_p
D
HD
e
E ^HE
A
A₂
A₁
31
30
ZD
wM
b_p
vM A
B
vM B
Q
(A ₃)
θ
L_p
L
detail X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
L_p
Q
v
w
y
Z _D ⁽¹⁾
Z
(1)
E
θ
mm
3.20
0.25
0.05
2.90
2.65
0.25
0.40
0.25
0.25
0.14
20.1
19.9
14.1
13.9
0.65
24.2
23.6
18.2
17.6
1.95
1.0
0.6
1.4
1.2
0.2 0.15 0.1
0.8
0.4
1.0
0.6
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT317-2
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
1996 Aug 13
29