PIP212-12M Datasheet, PDF (21/21 Pages) NXP Semiconductors – DC-to-DC converter powertrain

Philips Semiconductors
22. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
Basic operation . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
Undervoltage Lockout (UVLO) . . . . . . . . . . . . . 4
7.3
Boost switch . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.4
V_DDG regulator . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.5
3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.6
Automatic Dead-time Reduction (ADR) . . . . . . 5
7.7
Over Temperature Protection (OTP) . . . . . . . . . 6
7.8
Am I Switching (AIS). . . . . . . . . . . . . . . . . . . . . 6
7.9
Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.10
Reg5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11
Application information. . . . . . . . . . . . . . . . . . 11
11.1
Typical application. . . . . . . . . . . . . . . . . . . . . . 11
11.2
V_DDG supply options . . . . . . . . . . . . . . . . . . . . 12
12
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
14.1
Introduction to soldering surface
mount packages . . . . . . . . . . . . . . . . . . . . . . . 15
14.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15
14.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
14.5
Package related soldering information . . . . . . 16
15
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
15.1
PCB design guidelines . . . . . . . . . . . . . . . . . . 17
15.2
Solder paste printing. . . . . . . . . . . . . . . . . . . . 18
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
21
Contact information . . . . . . . . . . . . . . . . . . . . 20
PIP212-12M
DC-to-DC converter powertrain
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 2 March 2005
Document number: 9397 750 14586
Published in The Netherlands