PIP212-12M Datasheet, PDF (18/21 Pages) NXP Semiconductors – DC-to-DC converter powertrain

Philips Semiconductors
PIP212-12M
DC-to-DC converter powertrain
0.475
1.40
0.30
9.25 (2×)
8.30 (2×)
6.20 (2×)
0.50
0.25
1.60 0.40
0.45
0.525
7.04
(4 ×)
0.05
0.615
1.90
0.50
0.70 (3×)
e = 0.50
0.80 (2×)
0.29 (56×)
0.075
0.150
0.025
solder lands
Cu pattern
clearance
solder paste
placement area
0.50
0.425
2.00
7.20 (2×)
9.00 (2×)
occupied area
All dimensions in mm
Fig 17. PCB footprint for SOT684-4 package (reflow soldering)
001aaa064
15.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and small
size of the solder lands. A stencil thickness of 0.125 mm is recommended. The stencil
apertures can be made the same size as the solder lands in Figure 17.
The type of solder paste recommended for MLF packages is “No clean”, Type 3, due to
the difficulty of cleaning flux residues from beneath the MLF package.
9397 750 14586
Preliminary data sheet
Rev. 02 — 2 March 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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