English
Language : 

BUK573-48C Datasheet, PDF (2/9 Pages) NXP Semiconductors – PowerMOS transistor Clamped logic level FET
Philips Semiconductors
PowerMOS transistor
Clamped logic level FET
Product specification
BUK573-48C
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
V(BR)DG
VGS(TO)
VGS(ON)
IDSS
IGSS
RDS(ON)
Drain-gate zener voltage
Gate threshold voltage
Gate voltage
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance
0.2 < -IG < 0.4 mA;
-55˚C < Tj < 150˚C
VDS = VGS; ID = 1 mA
VDS = 10 V; ID = 10 A;
-55˚C < Tj < 150˚C
VDS = 30 V; VGS = 0 V; Tj =150 ˚C
VGS = ±15 V; VDS = 0 V; Tj =150 ˚C
VGS = 5 V; ID = 10 A
MIN. TYP. MAX. UNIT
38 45 54
V
1.0 1.5 2.0 V
2.0 3.1 4.0 V
- 0.01 1.0 mA
-
0.1 10 µA
-
65 85 mΩ
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
V(CL)DSR
Drain source clamp voltage
(peak value)
gfs
Forward transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Feedback capacitance
td on
Turn-on delay time
tr
Turn-on rise time
td off
Turn-off delay time
tf
Turn-off fall time
Ld
Internal drain inductance
Ls
Internal source inductance
CONDITIONS
RG = 10 kΩ; ID = 10 A;
-55 < Tj < 150˚C; Inductive load.
VDS = 25 V; ID = 10 A
VGS = 0 V; VDS = 25 V; f = 1 MHz
VDD = 12 V; ID = 5 A;
VGS = 5 V; RG = 10 kΩ;
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
MIN. TYP. MAX. UNIT
40 48 58
V
7
12
-
S
- 550 825 pF
- 240 350 pF
- 100 160 pF
-
3.5
-
µs
-
22
-
µs
-
16
-
µs
-
18
-
µs
-
4.5
-
nH
-
7.5
-
nH
ISOLATION
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
Visol(rms)
R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal waveform;
three terminals to external
R.H. < 65 %; clean and dust free
heatsink
Cisol
Capacitance from T2 to
external heatsink
f = 1 MHz
MIN.
-
-
TYP. MAX. UNIT
-
2500 VRMS
10
-
pF
August 1994
2
Rev 1.000