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TDA8922B Datasheet, PDF (19/32 Pages) NXP Semiconductors – 2 X 50 W class-D power amplifier | |||
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Philips Semiconductors
TDA8922B
2 à 50 W class-D power ampliï¬er
13.8 Application schematic
Notes to the application schematic:
⢠A solid ground plane around the switching ampliï¬er is necessary to prevent emission.
⢠100 nF capacitors must be placed as close as possible to the power supply pins of the
TDA8922BTH.
⢠The internal heat spreader of the TDA8922BTH is internally connected to VSS.
⢠The external heatsink must be connected to the ground plane.
⢠Use a thermal conductive electrically non-conductive Sil-Pad® between the backside
of the TDA8922BTH and a small external heatsink.
⢠The differential inputs enable the best system level audio performance with
unbalanced signal sources. In case of hum due to ï¬oating inputs, connect the
shielding or source ground to the ampliï¬er ground. Jumpers J1 and J2 are open on
set level and are closed on the stand-alone demo board.
⢠Minimum total required capacity per power supply line is 3300 µF.
9397 750 13357
Preliminary data sheet
Rev. 01 â 1 October 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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