80CL410 Datasheet, PDF (12/28 Pages) NXP Semiconductors – Low voltage/low power single-chip 8-bit microcontroller with I2C

Philips Semiconductors
Low voltage/low power single-chip
8-bit microcontroller with I²C
Product specification
80CL410/83CL410
IRQ1 (C0H)
Interrupt request flag register
7
6
5
43
21
0
IQ9 IQ8 IQ7 IQ6 IQ5 IQ4 IQ3 IQ2
Bit Symbol
Function
IRQ1.7 IQ9 External interrupt 9 request
flag
IRQ1.6 IQ8 External interrupt 8 request
flag
IRQ1.5 IQ7 External interrupt 7 request
flag
IRQ1.4 IQ6 External interrupt 6 request
flag
IRQ1.3 IQ5 External interrupt 5 request
flag
IRQ1.2 IQ4 External interrupt 4 request
flag
IRQ1.1 IQ3 External interrupt 3 request
flag
IRQ1.0 IQ2 External interrupt 2 request
flag
Priority Vector
X0 (highest) 0003H
S1
002BH
X5
0053H
T0
000BH
X6
005BH
X1
0013H
X2
003BH
X7
0063H
T1
001BH
X3
0043H
X8
006BH
X4
004BH
X9 (lowest) 0073H
Source
External 0
I²C port
External 5
Timer 0
External 6
External 1
External 2
External 7
Timer 1
External 3
External 8
External 4
External 9
Register Function
IX1
Interrupt polarity register
IRQ1 Interrupt request flag
register
IEN0 Interrupt enable register
IEN1 Interrupt enable register
(INT2–INT9)
IP0
Interrupt priority register
IP1
Interrupt priority register
(INT2–INT9)
SFR
Address
E9H
C0H
A8H
E8H
B8H
F8H
OSCILLATOR CIRCUITRY
The on-chip oscillator circuitry of the
8XCL410 is a single stage inverting amplifier
biased by an internal feedback resistor. (See
Figure 4.) The oscillator can be operated with
a quartz crystal, ceramic resonator, LC
network or RC network. See Figure 5 for
different configurations. When ordering parts,
it is necessary to specify an oscillator option.
The options are: RC when an RC network will
be used, OSC 2 for oscillator operation below
4MHz, OSC 3 for oscillator operation from
4MHz to 10MHz, OSC 4 for oscillator
operation above 10MHz, and 32kHz if 32kHz
to 400kHz operation is desired.
For operation as a standard quartz oscillator,
no external components are needed (except
at 32KHz). When using external capacitors,
ceramic resonators, coils, and RC networks
to drive the oscillator, five different
configurations are supported (see Figure 5
and Table 4).
In the power-down mode the oscillator is
stopped and XTAL1 is pulled high. The
oscillator inverter is switched off to ensure no
current will flow. To drive the device with an
external clock source, apply the external
clock signal to XTAL1, and leave XTAL2 to
float, as shown in Figure 5(f). There are no
requirements on the duty cycle of the
external clock, since the input to the internal
clocking circuitry is split using a flip-flop.
The following options are provided for
optimum on-chip oscillator performance.
Please state option when ordering:
Osc.1: Figure 5(c). An option for 32kHz
clock applications with external
trimmer for frequency adjustment.
A 4.7MΩ bias resistor must be
connected in parallel with the
crystal.
Osc.2: Figure 5(e). An option for low-power,
low-frequency operations using LC
components or quartz.
Osc.3: An option for medium frequency
range applications.
Osc.4: An option for high frequency range
applications.
RC: Figure 5(g). An option for an RC
oscillator.
The equivalent circuit data of the internal
oscillator compares with that of matched
crystals.
The externally adjustable RC oscillator has a
frequency range from 100kHz to 500kHz.
(See Figure 7.)
Power-on Reset
The 8XCL410 contains on-chip circuitry
which switch the port pins to the
customer-defined logic level as soon as V_DD
exceeds 1.3V if the mask option “ON” has
been chosen (see Figures 8 and 9). As soon
as the minimum supply voltage is reached,
the oscillator will start up. However, to ensure
that the oscillator is stable before the
controller starts, the clock signals are gated
away from the CPU for a further 1536
oscillator periods.
An hysteresis of approximately 50mV at a
typical power-on switching level of 1.3V will
ensure correct operation.
The on-chip power–on reset circuitry can also
be switched off via the mask option “OFF”.
This option reduces the power-down current
to typically 800µA and can be chosen if
external reset circuitry is used. For
applications not requiring the internal reset,
option “OFF” should be chosen.
An automatic reset can be obtained at
power-on by connecting the RST pin to V_DD
via a 10µF capacitor. At power-on, the
voltage on the RST pin is equal to V_DD minus
the capacitor voltage, and decreases from
V_DD as the capacitor discharges through the
internal resistor R_RST to ground. The larger
the capacitor, the more slowly V_RST
decreases. V_RST must remain above the
lower threshold of the Schmitt trigger long
enough to effect a complete reset. The time
required is the oscillator start-up time, plus 2
machine cycles.
P80CL410:
ROM-less VERSION OF P83CL410
The P80CL410 is a low voltage ROMless
version of the P83CL410. The mask options
on the P80CL410 are fixed as follows:
• Port Options:
All ports except P16/P17 have option “1S”,
i.e., standard port, High after reset. The
ports P16/P17 have option “2S”, i.e., open
drain, High after reset.
• Oscillator option: OSC3
• Power-on Reset option: OFF
1995 Jan 20
12