BUK7C08-55AITE Datasheet, PDF (11/15 Pages) NXP Semiconductors – TrenchPLUS standard level FET

Philips Semiconductors
BUK7C08-55AITE
TrenchPLUS standard level FET
6. Package outline
Plastic single-ended surface mounted package (Philips version of D²-PAK);
7 leads (one lead cropped)
SOT427
E
D1
D
HD
4
1
7
b
e e eee e
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
E
e
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60 10.30 _1.27
1.20 9.70
Lp
HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT427
Fig 20. SOT427 (D²-PAK).
9397 750 11696
Product data
REFERENCES
JEDEC
EIAJ
Rev. 01 — 19 August 2003
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25
01-04-18
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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