74F821 Datasheet, PDF (10/18 Pages) NXP Semiconductors – Bus interface registers

Philips Semiconductors
Bus interface registers
Product specification
74F821/822/823/824/825/826
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
V_CC
V_IH
V_IL
I_Ik
I_OH
I_OL
T_amb
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High–level output current
Low–level output current
Operating free-air temperature range
Commercial range
Industrial range
LIMITS
UNIT
MIN
NOM
MAX
4.5
5.0
5.5
V
2.0
V
0.8
V
–18
mA
–24
mA
64
mA
0
+70
°C
–40
+85
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS¹
LIMITS
UNIT
MIN TYP² MAX
V_OH
High-level output voltage
V_OL
Low-level output voltage
±10%V_CC 2.4
V
V_CC = MIN,
V_IL = MAX,
I_OH = –15mA
±5%V_CC
2.4
V
V_IH = MIN
±10%V_CC 2.0
I_OH = –24mA _{±5%VCC 2.0}
V
V
V_CC = MIN,
V_IL = MAX,
V_IH = MIN
I_OL = MAX
±10%V_CC
±5%V_CC
0.55 V
0.42 0.55 V
V_IK
I_I
I_IH
I_IL
I_OZH
I_OZL
I_OS
Input clamp voltage
Input current at maximum input voltage
High–level input current
Low–level input current
Off–state output current, high–level voltage applied
Off–state output current, low–level voltage applied
Short–circuit output current³
74F821,
74F822
I_CCH
I_CCL
I_CCZ
V_CC = MIN, I_I = I_IK
V_CC = 0.0V, V_I = 7.0V
V_CC = MAX, V_I = 2.7V
V_CC = MAX, V_I = 0.5V
V_CC = MAX, V_O = 2.7V
V_CC = MAX, V_O = 0.5V
V_CC = MAX
V_CC = MAX
–0.73 –1.2 V
100 µA
20 µA
–20 µA
50 µA
–50 µA
-100
-225 mA
75 105 mA
75 105 mA
75 115 mA
I_CC
Supply current (total)
74F823,
74F824
I_CCH
I_CCL
I_CCZ
V_CC = MAX
65 100 mA
70 105 mA
75 110 mA
74F825,
74F826
I_CCH
I_CCL
V_CC = MAX
60
85 mA
60
90 mA
I_CCZ
65
95 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
1996 Jan 05
10