N34TS04 Datasheet, PDF (17/18 Pages) ON Semiconductor – Digital Output Temperature Sensor

N34TS04
PACKAGE DIMENSIONS
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ
ISSUE A
D
A
ÇÇ _{PIN ONE}
REFERENCE
ÇÇÇÇÇÇ 0.10 C
0.10 C _{TOP VIEW}
0.10 C
DETAIL B
0.08 C
NOTE 4
A1
SIDE VIEW
B
E
A
A3
L
L
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
A3
ÉÉÇÉÉÇ ÉÉÇÉÉÇ ^EXPOSEDCu
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.20 0.30
D
2.00 BSC
D2 1.35 1.45
E
3.00 BSC
E2 1.25 1.35
e
0.50 BSC
L 0.25 0.35
L1 −−− 0.15
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
D2
L
1
4
1.56
8X 0.68
E2
1.45 3.40
8
5
8X b
e
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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