N34TS04 Datasheet, PDF (16/18 Pages) ON Semiconductor – Digital Output Temperature Sensor

N34TS04
PACKAGE DIMENSIONS
TDFN8, 2x3, 0.5P
CASE 511AK
ISSUE B
D
AB
L1
ÇÇÇ _{PIN ONE}
REFERENCE
ÇÇÇÇÇÇÇÇÇ _{0.10 C}
E
0.10 C _{TOP VIEW}
0.10 C
DETAIL B
A
A3
0.08 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
DETAIL A
D2
L
1
4
L
L
DETAIL A
ALTERNATE
CONSTRUCTIONS
ÇÉÉÇÉÉ ^{EXPOSED Cu}
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D
2.00 BSC
D2 1.30 1.50
E
3.00 BSC
E2 1.20 1.40
e
0.50 BSC
L 0.20 0.40
L1 −−− 0.15
RECOMMENDED
SOLDERING FOOTPRINT*
1.56
8X 0.68
E2
1.45 3.40
8
5
8X b
e
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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