AMIS-30621 Datasheet, PDF (1/59 Pages) AMI SEMICONDUCTOR – LIN Microstepping Motordriver

AMIS-30621
Micro-Stepping Motor Driver
INTRODUCTION
The AMIS−30621 is a single−chip micro−stepping motor driver
with position controller and control/diagnostic interface. It is ready to
build dedicated mechatronics solutions connected remotely with a
LIN master.
The chip receives positioning instructions through the bus and
subsequently drives the motor coils to the desired position. The
on−chip position controller is configurable (OTP or RAM) for
different motor types, positioning ranges and parameters for speed,
acceleration and deceleration. The AMIS−30621 acts as a slave on the
LIN bus and the master can fetch specific status information like
actual position, error flags, etc. from each individual slave node.
The chip is implemented in I2T100 technology, enabling both high
voltage analog circuitry and digital functionality on the same chip.
The AMIS−30621 is fully compatible with the automotive voltage
requirements.
http://onsemi.com
SOIC−20
3 & 7 SUFFIX
CASE 751AQ
PRODUCT FEATURES
Motordriver
• Micro−Stepping Technology
• Peak Current Up to 800 mA
• Fixed Frequency PWM Current−Control
• Automatic Selection of Fast and Slow Decay Mode
• No External Fly−Back Diodes Required
• Compliant with 14 V Automotive Systems and Industrial
Systems Up to 24 V
Controller with RAM and OTP Memory
• Position Controller
• Configurable Speeds and Acceleration
• Input to Connect Optional Motion Switch
LIN Interface
• Physical Layer Compliant to LIN rev. 2.0. Data−Link
Layer Compatible with LIN Rev. 1.3 (Note 1)
• Field−Programmable Node Addresses
• Dynamically Allocated Identifiers
• Diagnostics and Status Information
Protection
• Overcurrent Protection
• Undervoltage Management
• Open−Circuit Detection
• High Temperature Warning and Management
• Low Temperature Flag
• LIN Bus Short−Circuit Protection to Supply and Ground
• Lost LIN Safe Operation
NQFP−32
6 SUFFIX
CASE 560AA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Power Saving
• Powerdown Supply Current < 50 mA
• 5 V Regulator with Wake−up on LIN Activity
EMI Compatibility
• LIN Bus Integrated Slope Control
• HV Outputs with Slope Control
• These are Pb−Free Devices
1. Minor exceptions to the conformance of the data−link layer to LIN rev. 1.3.
© Semiconductor Components Industries, LLC, 2010
1
February, 2010 − Rev. 4
Publication Order Number:
AMIS−30621/D