TDA8595 Datasheet, PDF (47/50 Pages) NXP Semiconductors – I2C-bus controlled 4 ´ 45 W power amplifier

NXP Semiconductors
16. Mounting
TDA8595
I²C-bus controlled 4 × 45 W power amplifier
2
1
27
26
hole diameter min. 0.92
∅ 0.08 M
1
2.54
2
Dimensions in mm sot878-1_fr
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e₁’ in Figure 40; dimension ‘2’ relates to dimension ‘e₂’ in
Figure 40.
Fig 41. SOT878-1 reflow soldering footprint
17. Abbreviations
Table 18. Abbreviations
Acronym
Description
BCDMOS
Bipolar CMOS/DMOS
BTL
Bridge Tied Load
CMOS
Complementary Metal-Oxide Semiconductor
DMOS
Diffusion Metal Oxide Semiconductor
DSP
Digital Signal Processor
EMC
ElectroMagnetic Compatibility
ESR
Equivalent Series Resistance
NMOS
Negative Metal Oxide Semiconductor
PMOS
Positive Metal Oxide Semiconductor
POR
Power-On Reset
SOAR
Safe Operating ARea
SOI
Silicon On Insulator
TDA8595_2
Product data sheet
Rev. 02 — 21 November 2007
© NXP B.V. 2007. All rights reserved.
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