TDA8595 Datasheet, PDF (46/50 Pages) NXP Semiconductors – I2C-bus controlled 4 ´ 45 W power amplifier

NXP Semiconductors
TDA8595
I²C-bus controlled 4 × 45 W power amplifier
RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm)
SOT878-1
non-concave
x
D_h
D
E_h
d
j
1
27
Z
e₁
e
wM
b_p
view B: mounting base side
A₂
B
E
A
L
c _e2
Q
vM
L₁
0
DIMENSIONS (mm are the original dimensions)
10
scale
20 mm
UNIT A
A₂ b_p
c D⁽¹⁾ d
D_h E⁽¹⁾ e
e₁ e₂ E_h
j
L
L₁ Q
v
w
x Z⁽¹⁾
mm
13.5
4.65 0.60
4.35 0.45
0.5 29.2 25.8
0.3 28.8 25.4
12
15.9
15.5
2
1 2.54 8
3.4 3.75 3.75 2.1
3.1 3.15 3.15 1.8
0.6
0.25 0.03
1.8
1.2
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
OUTLINE
VERSION
IEC
SOT878-1
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-01-11
05-01-26
Fig 40. Package outline SOT878-1 (RDBS27P)
TDA8595_2
Product data sheet
Rev. 02 — 21 November 2007
© NXP B.V. 2007. All rights reserved.
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