TDA8920C Datasheet, PDF (34/40 Pages) NXP Semiconductors – 2 X110 W class-D power amplifier

NXP Semiconductors
14. Package outline
TDA8920C
2 × 110 W class-D power amplifier
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
SOT411-1
non-concave
x
Dh
D
Eh
d
β
view B: mounting base side
A₂
A₅
A₄
B
E₂
j
E
E₁
L₂
L₁
L₃
L
Q
c
vM
1
23
Z
e₁
wM
b_p
e
m
e₂
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A₂ A₄ A₅ b_p c D⁽¹⁾ d D_h E⁽¹⁾ e e ₁ e ₂ E_h E ₁ E ₂ j L L ₁ L ₂ L₃ m Q v w x β Z ⁽¹⁾
mm
4.6 1.15 1.65 0.75 0.55 30.4 28.0 ₁₂ 12.2 _{2.54 1.27 5.08}
4.3 0.85 1.35 0.60 0.35 29.9 27.5
11.8
6
10.15 6.2 1.85 3.6
9.85 5.8 1.65 2.8
14 10.7 2.4
13 9.9 1.6
4.3
2.1
1.8
0.6
0.25 0.03
45°
1.43
0.78
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT411-1
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
98-02-20
02-04-24
Fig 29. Package outline SOT411-1 (DBS23P)
TDA8920C_1
Preliminary data sheet
Rev. 01 — 29 September 2008
© NXP B.V. 2008. All rights reserved.
34 of 40