SA56004X Datasheet, PDF (32/36 Pages) NXP Semiconductors – 1 Degrees Celcious accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with over temperature alarms

NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Table 21. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm³)
< 350
350 to 2000
< 1.6
260
260
1.6 to 2.5
260
250
> 2.5
250
245
> 2000
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Mounting
15.1 Printed-circuit board layout considerations
Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the
remote temperature sensor inputs, especially in extremely noisy environments, such as a
computer motherboard. Noise induced in the traces running between the device sensor
inputs and the remote diode can cause temperature conversion errors. Typical sensor
signal levels to the SA56004X is a few microvolts. The following guidelines are
recommended:
1. Place the SA56004X as close as possible to the remote sensor. It can be from
4 inches to 8 inches, as long as the worst noise sources such as clock generator, data
and address buses, CRTs are avoided.
SA56004X_5
Product data sheet
Rev. 05 — 22 May 2008
© NXP B.V. 2008. All rights reserved.
32 of 36