SA56004X Datasheet, PDF (30/36 Pages) NXP Semiconductors – 1 Degrees Celcious accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with over temperature alarms

NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
13. Packing information
The SA56004X is packed in reels, as shown in Figure 23.
tape
guard band
reel assembly
tape detail
cover tape
barcode label
carrier tape
box
Fig 23. Tape and reel packing method
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14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
SA56004X_5
Product data sheet
Rev. 05 — 22 May 2008
© NXP B.V. 2008. All rights reserved.
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