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BUK9Y07-30B Datasheet, PDF (3/14 Pages) NXP Semiconductors – N-channel TrenchMOS logic level FET
NXP Semiconductors
BUK9Y07-30B
N-channel TrenchMOS logic level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
VDGR
VGS
ID
Parameter
Conditions
drain-source voltage
drain-gate voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
RGS = 20 kΩ
gate-source voltage
drain current
Tmb = 25 °C; VGS = 5 V; see Figure 1; [1]
see Figure 4
Min Typ Max Unit
-
-
30 V
-
-
30 V
-15 -
15 V
-
-
75 A
Tmb = 100 °C; VGS = 5 V; see Figure 1
-
-
63 A
IDM
peak drain current
Tmb = 25 °C; tp ≤ 10 µs; pulsed;
see Figure 4
-
-
356 A
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Source-drain diode
Tmb = 25 °C; see Figure 2
-
-
-55 -
-55 -
105 W
175 °C
175 °C
IS
source current
Tmb = 25 °C
[1]
-
-
75 A
ISM
peak source current tp ≤ 10 µs; pulsed; Tmb = 25 °C
-
-
356 A
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source
avalanche energy
ID = 75 A; Vsup ≤ 30 V; RGS = 50 Ω;
VGS = 5 V; Tj(init) = 25 °C; unclamped
-
-
198 mJ
EDS(AL)R
repetitive drain-source see Figure 3
avalanche energy
[2][3][4][ -
-
-
J
5]
[1] Continuous current is limited by package.
[2] Maximum value not quoted. Repetitive rating defined in avalanche rating figure.
[3] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[4] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[5] Refer to application note AN10273 for further information.
BUK9Y07-30B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 7 April 2010
© NXP B.V. 2010. All rights reserved.
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