SAF3560 Datasheet, PDF (15/20 Pages) NXP Semiconductors – Terrestrial digital radio processor Providing new data services

NXP Semiconductors
10. Soldering
Footprint information for reflow soldering of HLQFP144 package
SAF3560
Terrestrial digital radio processor
SOT612-4
Hx
Gx
P2
P1
(0.125)
Hy Gy
SPx
nSPx
SPy
SLy
SPx tot
SLx
nSPy
By Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste
occupied area
nSPx nSPy
4
4
DIMENSIONS in mm
P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy SLx SLy SPx tot SPy tot SPx SPy
0.500 0.560 23.300 23.300 20.300 20.300 1.500 0.280 0.400 20.500 20.500 23.550 23.550 4.500 4.500 4.400 4.400 0.750 0.750
Fig 5. Soldering footprint SOT612-4 (HLQFP144)
SAF3560_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 15 September 2010
© NXP B.V. 2010. All rights reserved.
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