SAF3560 Datasheet, PDF (14/20 Pages) NXP Semiconductors – Terrestrial digital radio processor Providing new data services

NXP Semiconductors
9. Package outline
SAF3560
Terrestrial digital radio processor
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
SOT612-4
y
exposed die pad
c
X
D_h
A
108
109
73
72
Z_E
e
E_h
E HE
A
A₂
A₁
144
1
pin 1 index
wM
e
b_p
D
H_D
wM
b_p
37
36
Z_D
vM A
B
vM B
detail X
(A₃)
θ
L_p
L
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT ^A
max
A₁
A₂
A₃
b_p
c D⁽¹⁾ D_h E⁽¹⁾ E_h
e
H_D H_E
L
mm
1.6
0.12
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
4.3
4.1
20.1
19.9
4.3
4.1
0.5
22.15 22.15
21.85 21.85
1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT612-4
MS-026
L_p
v
w
y Z_D(1) Z_E(1) θ
0.75
0.45
0.2
0.08 0.08
1.4
1.1
1.4
1.1
7^°
0^°
EUROPEAN
PROJECTION
ISSUE DATE
07-12-11
08-01-18
Fig 4. Package outline SOT612-4 (HLQFP144)
SAF3560_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 15 September 2010
© NXP B.V. 2010. All rights reserved.
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