M36W0R6050T1 Datasheet, PDF (18/22 Pages) STMicroelectronics – 64 Mbit (4 Mb ×16, Multiple Bank, Burst) Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multi-chip package

Package mechanical
6
Package mechanical
M36W0R6050T1, M36W0R6050B1
In order to meet environmental requirements, Numonyx offers the M36W0R6050T1 and
M36W0R6050B1 devices in ECOPACK® packages. These packages have a Lead-free
second-level interconnect. The category of Second-Level Interconnect is marked on the
package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 6.
Stacked TFBGA88 8 × 10 mm - 8 × 10 active ball array, 0.8 mm pitch,
package outline
D
D1
e
SE
E E2 E1
b
BALL "A1"
FE FE1
A
FD
SD
A2
A1
1. Drawing is not to scale.
ddd
BGA-Z42
18/22