LMH7324_0710 Datasheet, PDF (4/20 Pages) National Semiconductor (TI) – Quad 700 ps High Speed Comparator with RSPECL Outputs

5V AC Electrical Characteristics
Unless otherwise specified, all limits are guaranteed for T_J = 25°C. V_CCI = V_CCO = 5V, V_EE = 0V, R_L = 50Ω to V_CCO-2V,
V_CM = 300 mV. (Note 7)
Symbol
Parameter
Conditions
Min
Typ
Max
(Note 6) (Note 5) (Note 6)
TR
Maximum Toggle Rate
Overdrive = ±50 mV, C_L = 2 pF
3.72
@ 50% Output Swing
Minimum Pulse Width
Overdrive = ±50 mV, C_L = 2 pF
290
@ 50% Output Swing
Jitter
Overdrive = ±50 mV, C_L = 2 pF
<1
@ freq = 140 MHz
t_PDH
Propagation Delay
Overdrive 20 mV
740
(see Figure 3 application note)
Overdrive 50 mV
731
Input SR = Constant
Overdrive 100 mV
722
V_IN Startvalue = V_REF −100 mV
Overdrive 1V
740
t_OD-disp
Input Overdrive Dispersion
T_PDH @ Overdrive 20 mV ↔ 100 mV
18
T_PDH @ Overdrive 100 mV ↔ 1V
19
t_SR-disp
Input Slew Rate Dispersion
0.1 V/ns to 1 V/ns,
40
Overdrive = 100 mV
t_CM-disp Input Common Mode Dispersion SR = 1 V/ns, Overdrive 100 mV,
24
0V ≤ V_CM ≤ V_CCI – 2V
Δt_PDLH-disp Q to Q Time Skew
Overdrive = 50 mV, C_L = 2 pF
60
| t_PDH - t_PDL | (Note 8)
Δt_PDHL
Q to Q Time Skew
Overdrive = 50 mV, C_L = 2 pF
40
| t_PDL - t_PDH | (Note 8)
t_r
Output Rise Time (20% - 80%)
Overdrive = 50 mV, C_L = 2 pF
145
(Note 9)
t_f
Output Fall Time (20% - 80%)
Overdrive = 50 mV, C_L = 2 pF
145
(Note 9)
Units
Gb/s
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Conditions indicate specifications for which the
device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical
Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC)
Note 3: The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
Note 4: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C.
Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that T_J = T_A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where
T_J > T_A.
Note 8: Propagation Delay Skew, Δt_PD, is defined as the average of Δt_PDLH and Δt_PDHL.
Note 9: The rise or fall time is the average of the Q and Q rise or fall time.
Note 10: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.
Note 11: Positive current corresponds to current flowing into the device.
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