UPD789304 Datasheet, PDF (58/64 Pages) NEC – 8-BIT SINGLE-CHIP MICROCONTROLLER

µPD789304, 789306, 789314, 789316
14. RECOMMENDED SOLDERING CONDITIONS
The µPD789304, 789306, 789314, and µPD789316 should be soldered and mounted under the following
recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 14-1. Surface Mounting Type Soldering Conditions
µPD789304GC-×××-AB8: 64-pin plastic QFP (14 × 14)
µPD789306GC-×××-AB8: 64-pin plastic QFP (14 × 14)
µPD789314GC-×××-AB8: 64-pin plastic QFP (14 × 14)
µPD789316GC-×××-AB8: 64-pin plastic QFP (14 × 14)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: three times or less
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: three times or less
Solder bath temperature: 260°C max., Time: 10 seconds max., Count:
Once, Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Do not use different soldering method together (except for partial heating).
µPD789304GK-×××-9ET: 64-pin plastic TQFP (fine pitch) (12 × 12)
µPD789306GK-×××-9ET: 64-pin plastic TQFP (fine pitch) (12 × 12)
µPD789314GK-×××-9ET: 64-pin plastic TQFP (fine pitch) (12 × 12)
µPD789316GK-×××-9ET: 64-pin plastic TQFP (fine pitch) (12 × 12)
Soldering Method
Infrared reflow
VPS
Partial heating
Soldering Conditions
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 10 hours)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 10 hours)
Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR35-107-2
VP15-107-2
—
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering method together (except for partial heating).
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Data Sheet U14384EJ1V0DS