PRF18BA471QB5RB Datasheet, PDF (97/104 Pages) Murata Manufacturing Co., Ltd. – POSISTOR for Circuit Protection

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
R90E.pdf
Sep.24,2012
Continued from the preceding page.
(2) Adhesive Application and Curing
(a) If insufficient adhesive is applied, or if the adhesive
is not sufficiently hardened, this product may have a
loose contact with the land, during flow soldering.
(b) Too low viscosity of adhesive causes this product to
slip on the board, after mounting.
Allowable Flow Soldering Temp. and Time
270
260
250
240
230
220
210
200
0
10
20
30
Time (sec.)
!Caution/Notice
(3) Allowable Soldering Temperature and Time
(a) Solder within the temperature and time
combinations, indicated by the slanted lines in the
following graphs.
(b) Excessive soldering conditions may cause
dissolution of metallization or deterioration of
solder-wetting on the external electrode.
(c) In the case of repeated soldering, the accumulated
soldering time should be within the range shown in
the figures below. (For example, Reflow peak
temperature: 260°C, twice –> The accumulated
soldering time at 260°C is within 30sec.)
Allowable Reflow Soldering Temp. and Time
280
270
260
250
240
230
220
210
0 10 20 30 40 50 60 70 80 90 100110
Time (sec.)
(4) Recommendable Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on the
ceramic body. The difference between preheating
temperature and maximum temperature in the profile
should be 100°C.
(b) Rapid cooling by dipping in solvent or by other
means is not recommended.
Flow Soldering Conditions
Preheating (in air)
200
Soldering
250°C
Gradual cooling
(in air)
100
Reflow Soldering Conditions
Preheating (in air)
200
Soldering
250°C
Gradual cooling
(in air)
100
0
1 to 2 min.
*3 sec.
Preheating: 150±10°C, 1-2 minutes.
Soldering: 250°C, 3 sec.
* In the case of repeated soldering, the accumulated soldering
time should be within the range shown in "(3) Allowable
Soldering Temperature and Time."
0
1 to 2 min.
*20 sec.
Preheating: 150±10°C, 1-2 minutes.
Soldering: 250°C, 20 sec.
* In the case of repeated soldering, the accumulated soldering
time should be within the range shown in "(3) Allowable
Soldering Temperature and Time."
(5) There may be a risk of unexpected failures
(tombstone, insufficient solder-wetting, etc.) in the
mounting process caused by mounting conditions.
Please make sure that this product is correctly mounted
under the specified mounting conditions.
95