PRF18BA471QB5RB Datasheet, PDF (94/104 Pages) Murata Manufacturing Co., Ltd. – POSISTOR for Circuit Protection

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution/Notice
R90E.pdf
Sep.24,2012
c Notice (Soldering and Mounting) PRF15_103R Series
1. Solder and Flux
(1) Solder Paste
Use solder paste Sn:Pb=63:37wt%.
For your reference, we are using
63Sn/37Pb RMA9086 90-3-M18,
manufactured by Alpha Metals Japan Ltd.
96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V,
manufactured by Senju Metal Industry Co., LTD for any
Internal tests of this product.
2. Cleaning Conditions and Drying
To remove the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics
or any change to the external electrodes quality.
(1) Cleaning Conditions
Solvent
Dipping Cleaning Ultrasonic Cleaning
2-propanol
Less than 5 minutes
at room temp.
or
Less than 2 minutes
at 40˚C max.
Less than 1 minute
20W/L Frequency
of several 10kHz
to 100kHz.
A sufficient cleaning should be applied to remove flux completely.
(2) Drying
After cleaning, promptly dry this product.
3. Soldering Conditions
In your mounting process, observe the following points in
order to avoid deterioration of the characteristics or
destruction of this product. The mounting quality of this
product may also be affected by the mounting conditions,
shown in the points below.
This product is for reflow soldering only. Flow soldering
should not be allowed.
(1) Printing Conditions of Solder Paste
(a) Standard thickness of solder paste printing should
be from 0.10 to 0.15 mm.
(b) After soldering, the solder fillet should be a height
from 0.15 mm to the thickness of this product (see the
figure at right).
(c) Too much solder gives too strong mechanical stress
to this product. Such stress may cause cracking or
other mechanical damage. Also, it can destroy the
electrical performance of this product.
(2) Flux
Use rosin type flux in soldering process.
If below flux is used, some problems might be caused
in the product characteristics and reliability.
Please do not use below flux.
s3TRONGACIDICFLUXWITHHALIDECONTENTEXCEEDING
0.2wt%).
s7ATER SOLUBLEFLUX
(*Water-soluble flux can be defined as non rosin type
flux including wash-type flux and non-wash-type flux.)
E
Electrode
Solder
T
Solder
0.15mm V T V E
Continued on the following page.
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