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PRF18BA471QB5RB Datasheet, PDF (22/104 Pages) Murata Manufacturing Co., Ltd. – POSISTOR for Circuit Protection
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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Chip Type Specifications and Test Methods
R90E.pdf
Sep.24,2012
c PRG18/21BB Series
No.
Item
1 Operating Temp.
2 Resistance Value (at 25°C)
3 Withstanding Voltage
4 Adhesive Strength
Rating Value
Method of Examination
-10 to 60°C
The resistance value should be within the specified
tolerance.
Without damage
Temperature range with maximum voltage applied to PTC.
After applying maximum operating voltage for 3 mins. and
leaving for 2 hrs. in 25°C, measured by applying voltage of less
than 1.5Vdc (by a direct current of less than 10mA).
We apply 120% of the maximum operating voltage to PTC by
raising gradually for 180±5 secs. at 25°C. (A protective resistor
is to be connected in series, and the inrush current through
PTC must be limited below maximum rated value.)
EIAJ ET-7403 term 9
Soldered PTC to PCB and add a force of 5.0N in the direction
as shown below.
PTC
There is no sign of exfoliation on electrode.
F
F
5 Vibration
Normal appearance
Resistance change: not to exceed ±20% (*)
6 Solderability
Min. 75% electrode is covered with new solder.
Resistance change: not to exceed ±20% (*)
7 Soldering Heat Resistance
Normal appearance
Resistance change: not to exceed ±20% (*)
8 Temperature Cycling
Normal appearance
Resistance change: not to exceed ±20% (*)
Glass Epoxy PCB
F=5.0N
JIS C 5102 term 8.2
Soldered PTC to PCB
Vibration: A 10-55-10Hz (1 min.)
Width: 1.5mm
Vibrate for 2 hrs. in each of 3 mutually perpendicular planes
for a total of 6 hrs.
JIS C 5102 term 8.4
Solder: Sn 63%/Pb 37% (or 60/40%)
Solder temp: 230±5°C
Soaking time: 3±0.5 secs.
Soaking position: Until a whole electrode is soaked
Solder: Sn 63%/Pb 37% (or 60/40%)
Flux: Solder paste containing less than 0.2wt% of chlorine.
Preheating: 150±5°C 3 mins.
Peak temp.: 260±5°C 10±5 secs. (reflow)
PCB: Glass Epoxy PCB (JIS C 6484)
JIS C 5102 term 9.3
Times: 5 cycles
Step
1
2
3
4
Temp. (°C)
-20 +0, -3
Room temp.
+85 +3, -0
Room temp.
Time (min.)
30
10-15
30
10-15
9 Damp Heat
Normal appearance
Resistance change: not to exceed ±20% (*)
JIS C 5102 term 9.5
40±2°C, 90-95%RH leave for 500±4 hrs.
10 High Temperature Load
Normal appearance
Resistance change: not to exceed ±20% (*)
JIS C 5102 term 9.10
60±3°C (in air), PTC is applied maximum operating voltage for 1.5
hrs. on and 0.5 hrs. off. This cycle is repeated for 1000±10 hrs.
(*) Measure resistance after the test by applying voltage of less than 1.5Vdc by a direct current of less than 10mA after product is left at 25±2°C for 2 hours.
Above mentioned soldering in "4. Adhesive Strength" and "5. Vibration" is done under the following conditions at our site.
#Glass-Epoxy PC board
#Standard land dimension
#Standard solder paste
#Standard solder profile
Above conditions are mentioned in Notice.
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