PRF18BA471QB5RB Datasheet, PDF (95/104 Pages) Murata Manufacturing Co., Ltd. – POSISTOR for Circuit Protection

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
R90E.pdf
Sep.24,2012
Continued from the preceding page.
(2) Allowable Soldering Temperature and Time
(a) Solder within the temperature and time
combinations, indicated by the slanted lines in the
graphs at right.
(b) The excessive soldering conditions may cause
dissolution of metallization or deterioration of
solder-wetting on the external electrode.
(c) In case of repeated soldering, the accumulated
soldering time should be within the range shown
below figure. ( For example, Reflow peak temperature:
260°C, twice –> The accumulated soldering time at
260°C is within 30 sec. )
!Caution/Notice
Allowable Reflow Soldering Temp. and Time
280
270
260
250
240
230
220
210
0 10 20 30 40 50 60 70 80 90 100110
Time (sec.)
(3) Standard Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on
ceramic body. Difference between preheating
temperature and maximum temperature in the profile
should be 100°C.
(b) Rapid cooling by dipping in solvent or by other
means is not recommended.
Reflow Soldering Conditions
Preheating (in air)
200
Soldering
250°C
Gradual cooling
(in air)
100
0
1 to 2 min.
*20 sec.
Preheating: 150±10°C, 1 to 2 minutes
Soldering: 250°C, 20 seconds
* In case of repeated soldering, the accumulated soldering
time should be within the range shown above figure (2).
(4) There may be a risk of unexpected failures
(tombstone, insufficient solder-wetting, etc.) in the
mounting process, caused by the mounting conditions.
Please make sure that this product is correctly
mounted under specified mounting conditions.
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