GQM1885C2A6R2DB01D Datasheet, PDF (5/29 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL

■SPECIFICATIONS AND TEST METHODS
Test method : Deflection
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/03/15: t:0.8mm)
Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
(Coat with heat resistant resin for soldr)
Land ^b
f4.5
ﾗﾝﾄﾞ ^b
f4.5
Adhesive Strength of Termination,Vibration Resistance,Temperature Cycle,
Humidity ,Humidity Load,High Temperature Load
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/03/15: t:0.8mm)
Copper foil thickness : 0.035mm
c
*1,2：2.0±0.05
φ1.
5
+ 0.1
-0
4.0±0.1
＊1 ＊2
a
100
Fig.1
(in:mm)
Ａ
Glass epoxy board
Solder resist
Baked electrode or
copper foil
0.05以下
t
Fig.3
(in:mm)
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
GRM43
GRM55
Dimension (mm)
a
b
c
0.2
0.56
0.23
0.3
0.9
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0
1.65
2.2
5.0
2.0
2.2
5.0
2.9
3.5
7.0
3.7
4.5
8.0
5.6
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
GRM43
GRM55
Dimension (mm)
a
b
c
0.2
0.56
0.23
0.3
0.9
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0
1.65
2.2
5.0
2.0
2.2
5.0
2.9
3.5
7.0
3.7
4.5
8.0
5.6
citor
5
Support
20 ⁵⁰
Pressurization
speed
1.0mm/s
Pressurize
R230
Capacitance meter
45
45
Flexure:≦1
Fig.2
(in:mm)
JEMCGS-0001S
5