GQM1885C2A6R2DB01D Datasheet, PDF (19/29 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL

! Caution
4-2.Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in table 2. It is required to
keep temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Flow Soldering]
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
Soldering
Gradual
ΔT
Cooling
Preheating
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between electrodes and end termination.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in Table 2.
Table 2
Part Number
Temperature Differential
Time
30-90 seconds 5 seconds max.
[Allowable Soldering Temperature and Time]
280
270
260
250
240
230
220 ₀
10
20
30
40
Soldering Time(sec.)
GR□18/21/31
ΔT≦150℃
Recommended Conditions
Pb-Sn Solder Lead Free Solder
Preheating Peak Temperature 90～110℃ 100～120℃
Soldering Peak Temperature 240～250℃ 250～260℃
Atmosphere
Air
N₂
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Up to Chip Thickness
Adhesive
in section
JEMCGC-2701V
19