GQM1885C2A6R2DB01D Datasheet, PDF (26/29 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL

Notice
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
Chip Capacitor
Land
bending / etc if the land area is larger than needed and has an excess ^C
amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
b
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
a ^{Solder Resist}
Table 1 Flow Soldering Method
Dimensions
Part Number
Chip（L×W）
GR□18
1.6×0.8
a
0.6～1.0
b
0.8～0.9
c
0.6～0.8
GR□21
GR□31
2.0×1.25
3.2×1.6
1.0～1.2
2.2～2.6
0.9～1.0
1.0～1.1
0.8～1.1
1.0～1.4
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
L×W
（Dimensions
Tolerance）
GR□02
0.4×0.2
GR□03
0.6×0.3
GR□15
GR□18
GR□21
GR□31
GR□32
GR□43
GR□55
1.0×0.5
(within ±0.10)
1.0×0.5
（±0.15/±0.20）
1.6×0.8
(within ±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(within ±0.10)
2.0×1.25
(±0.15)
2.0×1.25
(±0.20)
3.2×1.6
(within±0.20)
3.2×1.6
(±0.30)
3.2×2.5
4.5×3.2
5.7×5.0
a
0.16～0.2
0.2～0.3
0.3～0.5
0.4～0.6
0.6～0.8
0.7～0.9
1.2
1.2
1.0～1.4
1.8～2.0
1.9～2.1
2.0～2.4
3.0～3.5
4.0～4.6
b
0.12～0.18
0.2～0.35
0.35～0.45
0.40～0.50
0.6～0.7
0.7～0.8
0.6
0.6～0.8
0.6～0.8
0.9～1.2
1.0～1.3
1.0～1.2
1.2～1.4
1.4～1.6
c
0.2～0.23
0.2～0.4
0.4～0.6
0.5～0.7
0.6～0.8
0.8～1.0
1.25
1.2～1.4
1.2～1.4
1.5～1.7
1.7～1.9
1.8～2.3
2.3～3.0
3.5～4.8
(in mm)
JEMCGC-2701V
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