GNM314R61A105MA13D Datasheet, PDF (5/24 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)

■SPECIFICATIONS AND TEST METHODS
Test method : Deflection
・Test substrate
Material : Copper-clad laminated sheets for PCBs
　　　　　　 　　 (Glass fabric base, epoxy resin)
Thickness : t:0.8mm
Copper foil thickness : 0.035mm
（Coat with heat resistant resin for solder）
・GN□□□4
・GNM□□2
100
5.0
a
b
c
1.0
d
100
5.0
a
b
c
1.0
d
Fig. 1 (in:mm)
20 ⁵⁰
Pressurization
speed
1.0mm/s
Pressurize
R230
Type
a
b
c
d
GNM1M2 2.0±0.05 0.5±0.05 0.32±0.05 0.32±0.05
GNM212 2.0±0.05 0.6±0.05 0.5±0.05 0.5±0.05
GNM214 2.0±0.05 0.7±0.05 0.3±0.05 0.2±0.05
GN□314 2.5±0.05 0.8±0.05 0.4±0.05 0.4±0.05
Capacitance meter
45
45
Flexure:≦1
Fig.2
Adhesive Strength of Termination,Vibration Resistance,Temperature Cycle,
Humidity Steady State,Humidity Load,High Temperature Load
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm
Copper foil thickness : 0.035mm
・GN□□□4
b
a
・GNM□□2
b
a
c
d
c
d
JEMCCS-0001K
Solder resist
Copper foil
Fig. 3 (in:mm)
Solder resist
Copper foil
5
(in:mm)
Type
a
b
c
d
GNM1M2 0.5
1.6
0.32
0.32
GNM212 0.6
1.8
0.5
0.5
GNM214 0.6
2.0
0.25
0.25
GN□314 0.8
2.5
0.4
0.4