GNM314R61A105MA13D Datasheet, PDF (16/24 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)

! Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature(℃)
Peak Temperature
200℃
ΔT
170℃
150℃
130℃
Soldering
Gradual
Cooling
Preheating
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
Part Number
GNM0M/GNM1M/GNM21/
GNM31
Temperature Differential
ΔT≦130℃
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature(℃)
Peak Temperature
ΔT
170℃
150℃
130℃
Soldering
Gradual
Cooling
Preheating
Time
60-120 seconds 20 seconds max.
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230～250℃
230～240℃
240～260℃
Atmosphere
Air
Air
Air or N₂
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
[Allowable Soldering Temperature and Time]
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(sec.)
4. Optimum Solder Amount for Reflow Soldering
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4-1. Overly thick application of solder paste results in
0.2mm min
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
in section
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.
Inverting the PCB Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCCC-0010Q
16