GNM314R61A105MA13D Datasheet, PDF (3/24 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)

■SPECIFICATIONS AND TEST METHODS
No
Item
11 Vibration Appearance
Resistance
Capacitance
Specification
Temperature
Compensating Type
High Dielectric Type
No defects or abnormalities.
Within the specified tolerance.
Q/D.F.
30pF and over:Q≧1000
ï¼»B1,R1,R6,R7ï¼½
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
W.V.:16V :0.035max.
C:Nominal Capacitance(pF) W.V.:6.3V :0.05max.
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V : 0.07max.
Test Method
Solder the capacitor on the test jig (glass epoxy board) in
the same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each 3 mutually perpendicular
directions(total of 6 hours).
12 Deflection Appearance No defects or abnormalities.
Capacitance Within ±5% or± 0.5pF
Change
(Whichever is larger)
Within ±10%
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig.1 using an eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
13 Solderability
of Termination
75% of the terminations is to be soldered evenly and
continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃ for 10 to 30 seconds.
After preheating , immerse in an eutectic solder solution for
2±0.5 seconds at 230±5℃.
14 Resistance to
Soldering Heat
Appearance
Capacitance
Change
Q/D.F.
The measured and observed characteristics should satisfy
the specifications in the following table.
No defects or abnormalities.
Within ±2.5% or± 0.25pF
B1,R1,R6,R7 :Within ±7.5%
(Whichever is larger)
F1,F5 :Within ±20%
30pF and over:Q≧1000
ï¼»B1,R1,R6,R7ï¼½
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
W.V.:16V :0.035max.
C:Nominal Capacitance(pF) W.V.:6.3V :0.05max.
Preheat the capacitor at 120 to 150℃ for 1 minute.
Immerse the capacitor in an eutectic solder solution at
270±5℃ for 10±0.5 seconds.
Let Sit at room temperature for 24±2 hours, then measure.
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours.
Perform the initial measurement.
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V : 0.07max.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Dielectric
Strength
15 Temperature Cycle
Appearance
Capacitance
Change
Q/D.F.
No defects.
The measured and observed characteristics should satisfy
the specifications in the following table.
No defects or abnormalities.
Within ±2.5% or± 0.25pF B1,R1,R6,R7 :Within ±7.5%
(Whichever is larger)
F1,F5 :Within ±20%
30pF and over:Q≧1000
ï¼»B1,R1,R6,R7ï¼½
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
W.V.:16V :0.035max.
C:Nominal Capacitance(pF) W.V.:6.3V :0.05max.
Fix the capacitor to the supporting jig in the same
manner and under the same conditions as (10).
Perform the five cycles according to the four heat
treatments shown in the following table.
Set for 24±2 hours at room temperature, then measure.
Step
1
2
3
4
Temp.(C)
Min.
Operating Temp.+0/-3
Room Temp
Max.
Operating Temp.+3/-0
Room Temp
Time (min)
30±3
2 to 3
30±3
2 to 3
[F1,F5]
W.V.:25Vmin : 0.05max. · Initial measurement for high dielectric constant type
W.V.:16V : 0.07max.
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Perform the initial measurement.
Dielectric
Strength
No defects.
JEMCCS-0001K
3