GNM314R61A105MA13D Datasheet, PDF (23/24 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)

Notice
2.Washing
1. Please evaluate a capacitor by actual cleaning equipment and condition surely
for confirming the quality and select the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
performance of the capacitors.
3.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
　curing process.
The stress is affected by the amount of resin and curing contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
lead to the deterioration of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the
insulation resistance of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
during transportation.
(1) Climatic condition
－ low air temperature：－40℃
－ change of temperature air/air：－25℃/＋25℃
－ low air pressure：30 kPa
－ change of air pressure：6 kPa/min
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly
passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the
surface of capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
The capacitor dropped accidentally during processing may be damaged.
JEMCCC-0010Q
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