GCM21BR72A104KA37L Datasheet, PDF (43/44 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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Continued from the preceding page.
No.
AEC-Q200
Test Item
2
Specifications
AEC-Q200 Test Method
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip L dimension: 2.5mm max. >
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Iron Board
< Chip L dimension: 3.2mm min. >
L
Capacitance
21
Temperature
Character-
istics
Capacitance
Change
-750±120 ppm/°C
(Temp. Range: +25 to +125°C)
-750±120, -347 ppm/°C
(Temp. Range: -55 to +25°C)
Capacitance Within ±0.5% or ±0.05 pF
Drift
(Whichever is larger)
0.6 L
Fig. 4
Speed supplied the Stress Load: 2.5mm / s
The capacitance change should be measured after 5 minutes
at each specified temperature stage.
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 the capacitance
should be within the specified tolerance for the temperature
coefficient. The capacitance drift is calculated by dividing the
differences between the maximum and minimum measured
values in steps 1, 3 and 5 by the capacitance value in step 3.
Step
1
2
3
4
5
Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
44