GCM21BR72A104KA37L Datasheet, PDF (29/44 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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1 ^{!Caution (Soldering and Mounting)}
Continued from the preceding page.
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature", "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (∆T) as small as possible.
2. After soldering, do not allow the component/PCB to
rapidly cool down.
3. The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, and that will cause a reduction in
the adhesive strength of the terminations.
4. Optimum Solder amount when re-working with a
Soldering lron
4-1. In case of sizes smaller than 0603, (GCM03/15/18),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm
whichever is smaller. In case of 0805 and larger
sizes, (GCM21/31/32), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component. If the solder amount is excessive, the
risk of cracking is higher during board bending or
under any other stressful condition.
4-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
4-3. Solder wire with ø0.5mm or smaller is required for
soldering.
Table 3
Part Number
Temperature
of Soldering
Iron Tip
Preheating
Temperature
Temperature
Differential
(∆T)
Atmosphere
GCM03/15/18/21/31 350°C max. 150°C min. ∆TV190°C Air
GCM32
280°C max. 150°C min. ∆TV130°C Air
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Solder Amount
in section
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
Continued on the following page.
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