GCM21BR72A104KA37L Datasheet, PDF (16/44 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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10.5.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Continued from the preceding page.
GCM SeriesSSppeceicfifciactaitoionns and Test Methods ₁
No.
AEC-Q200
Test Item
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200 Test Method
18
Board
Flex
Appearance
Capacitance
Change
Q/D.F.
I.R.
No marking defects
Within ±5.0% or ±0.5pF
(Whichever is larger)
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Within ±10.0%
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
b
C
a
100
t: 1.6mm
(GCM03/15: 0.8mm)
Fig. 1
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Type
a
GCM03
0.3
GCM15
0.5
GCM18
0.6
GCM21
0.8
GCM31
2.0
GCM32
2.0
20 ¹¹⁴
R4
b
0.9
1.5
2.2
3.0
4.4
4.4
Pressunzing
speed: 1.0mm/sec
Pressurize
c
0.3
0.6
0.9
1.3
1.7
2.6
(in mm)
Capacitance meter
45
45
Flexure: V2
(High Dielectric Type)
Flexure: V3
(Temperature
Compensating Type)
Fig. 2
Appearance No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM03/15)
19
Terminal
Strength
I.R.
*1
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Type
a
GCM03
0.3
GCM15
0.4
GCM18
1.0
GCM21
1.2
GCM31
2.2
GCM32
2.2
b
0.9
1.5
3.0
4.0
5.0
5.0
c
c
0.3
0.5
1.2
1.65
2.0
2.9
(in mm)
(t=1.6mm
GCM03/15: 0.8mm)
Solder resist
Fig. 3
Baked electrode or
copper foil
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length: 2.5mm max. >
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Iron Board
Speed supplied the Stress Load: 0.5mm / sec.
< Chip Length: 3.2mm min. >
L
*1: The figure indicates typical specification. Please refer to individual specifications.
0.6
Speed supplied the Stress Load: 2.5mm / sec.
Fig. 4
Continued on the following page.
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