GCM21BR72A104KA37L Datasheet, PDF (26/44 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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10.5.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
!Caution
!Caution (Soldering and Mounting) ₁
s Soldering and Mounting
1. Mounting Position
1. Confirm the best mounting position and direction that
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the
stress imposed on the chip during flexing or bending
of the board.
[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts.
[Chip Mounting Close to Board Separation Point]
Perforation
C
B
Chip arrangement
Worst A-C-(B~D) Best
D
A
Slit
2. Information before Mounting
1. Do not re-use capacitors that were removed from the
equipment.
2. Confirm capacitance characteristics under actual applied
voltage.
3. Confirm the mechanical stress under actual process and
equipment use.
4. Confirm the rated capacitance, rated voltage and other
electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors
that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat
treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit
board, any bending force against them shall be kept
to a minimum to prevent them from any bending
damage or cracking. Please take into account the
following precautions and recommendations for use
in your process.
(1) Adjust the lowest position of the pickup nozzle so
as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of
1N to 3N during mounting.
2. Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes greater force upon the
chip during mounting, causing cracked chips. Also the
locating claw, when worn out, imposes uneven forces on
the chip when positioning, causing cracked chips. The
suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
[Incorrect]
Suction Nozzle
[Correct]
Board
Deflection
Board Guide
Support Pin
Continued on the following page.
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