GCM21BR72A104KA37L Datasheet, PDF (35/44 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

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1 ^{Notice (Soldering and Mounting)}
Continued from the preceding page.
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Chip Capacitor
c
Land
b
a
Solder Resist
Table 1 Flow Soldering Method
Dimensions
Part Number
Chip (LgW)
GCM18
GCM21
GCM31
1.6g0.8
2.0g1.25
3.2g1.6
a
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
b
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
c
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
Chip (LgW)
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
0.6g0.3
1.0g0.5
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
a
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
b
0.2 to 0.35
0.35 to 0.45
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
c
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
(in mm)
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25°C).
3. Adhesive Coverage
Part Number
Adhesive Coverage*
GCM18
0.05mg min.
GCM21
0.1mg min.
GCM31
0.15mg min.
*Nominal Value
Board
Chip Capacitor
Adhesive
Land
a=20 to 70µm
b=30 to 35µm
c=50 to 105µm
a
c
b
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
36
Continued on the following page.