ERB1885C2E100GDX5D Datasheet, PDF (18/20 Pages) Murata Manufacturing Co., Ltd. – Application Spec ifi c Capacitors High Frequency Ceramic Capacitors

A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
C02E.pdf !Note ï Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uintítsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
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07.2.6 ^{ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
ERB Soldering and Mounting
!Caution C02E.pdf !Note ï Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uintítsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
sales repres_•en_Tt_ha_istiv_ce_as_tao_lor _gpr_ho_ad_suc_ot_ne_lyn_tg_yi_pn_ie_ce_ar_ls_spb_ee_cfo_ifr_ice_ao_tir_od_ne_sri_bn_eg_c. _{ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
07.2.6
Continued from the preceding page.
6_!. C_Cor_are_uc_tti_io_on_nwith a Soldering Iron
(1) For Chip Type Capacitors
When sudden heat is applied to the components by
6. sCooldrerericntgioirnonw, tihthe ameSchoaldneicrainl sgtrIernognth of the
(1)cFoomr pCohnipenTtsypsehoCualdpagcoitodroswn because remarkable
Wtemhepnersautdudreenchhaenagteiscapupsleiesddteofothrme ictyominpsiodneecnotsmbpyonents.
Table 3
Part Number
Ta_Gb_Rl_Me ₁2_5/18/21/31
Temperature
Differential
Peak
Temperature
Atmosphere
sInolodredreinrgtoirporne,vtehnetmmeecchhaannicicaallsdtraemnaggtheoinf tthhee
components,sphroeuhledagtiongdoswhonubldecbaeurseeqrueirmedarfkoarbbleoth of
tehme pcoemraptuorneecnhtsanagned cthaeusPeCsBdebfooarmrdi.tyPirneshideeatcinogmponents.
GJM_Pa1_r5_{t Number}
LLLE1R5/B1188/2/12/131
GQRM158/1281/21/31
Temperature
D_∆i_Tff_Ver₁e₉n₀t_Dial
300^P°C^eam^k ax.
3^Ts^ee^mco^pn^ed^rs^atm^ura^ex.
/ termination
Atmosphere
Air
Icnonodrditeiorntos aprevsehnotwmneicnhTaanbicleal3d.aImt isagreqinuirtheed to keep
cteommppeornaetunrtes,dpifrfeehreenattiianlgbsehtwouelednbteheresqouldirerdinfgorabnodththoef
tchoemcpoomnpeonntsesnutsrfanced (th∆eT)PaCsBsmboaallrda.sPproeshseibaltein.gAfter
csonlddeitrionngs, iat rise nsohtoawlnlowineTdatboleco2o. lItitisdorewqnuriraepdidtloy.keep
temperature differential between the soldering and the
EGRJMB185/21
GLLRLM1352/1/483/2/515/31
GNQM18/21
LELRABE11R88B//223112/31
LGLRMM2312/3/413/55
300°C max.
∆TV190D 3 seconds max.
Air
/ termination
270°C max.
∆TV130D 3 seconds max.
Air
/ termination
components surface (∆T) as small as possible. After
soldering, it is not allowed to cool it down rapidly.
EGRNBM32
270°C max.
*^LA^Lp^Apl¹ic⁸a^/b²le^1/f³o¹r both Pb-Sn a^∆n^Td ^VLe¹a³d⁰F^Dree So³lde^sr^e.^{conds max.}
Air
P_Lb_L-_MSn₂₁S_/o₃ld₁er: Sn-37Pb
/ termination
L_Ee_Ra_Bd ₃F₂ree Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount when Corrections Are Made
Using a Soldering lron
The top of the solder fillet should be lower than the
OthpictikmnuemssSoof lcdoemr Apomnoeunntst .wIhf ethneCsorldreecrtiaomnsouAnrteisMade
UexscinegssaivSeolyldbeigri,ntghelrornisk of cracking is higher during
Tbohaertdopbeonfdthinegsoorlduenrdfeilrleatnsyhouthlderbsetrleoswsefur lthcaondthitieons.
tShoicldkenreinssg oirfocnoøm3pmomneonrtss.mIfatlhleer ssohloduelrdabmeoruenqtuiisred. And
eitxiscensesciveeslsyabryigt,othkeeeripskaodfisctraancckeinbgeistwheigehnetrhedusroinldgering
biroanradnbdetnhdeincgomorpuonndeenrtsanwyithoothuetrdsirterecst stofuulccho.nTdhitrieoands.
13
Ssoollddeerriwngithiroøn0.ø53mmmmoor rsmsmaalleller rissrheoquuldirebdefroerqsuoirldeedr.inAgn.d
it is necessary to keep a distance between the soldering
iron and the components without direct touch. Thread
13
7. sWoaldsehr iwnigth ø0.5mm or smaller is required for soldering.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
7. bWroaksehninsgolder. Take note not to vibrate PCBs.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
FAbILroUkReEn TsoOldFeOr.LTLaOkWe nToHteEnAoBt tOoVvEibrCaAteUPTCIOBNsS. MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Up to Chip Thickness
Up to Chip Thickness
86
C-29-C
86
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