ERB1885C2E100GDX5D Datasheet, PDF (17/20 Pages) Murata Manufacturing Co., Ltd. – Application Spec ifi c Capacitors High Frequency Ceramic Capacitors

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High Frequency Ceramic Capacitors ^{If the PCB is flexed when leaded components (such as}
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
ERB Soldering and Mounting Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
Ca pa c i t o rs
5. Flow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. And an excessively long
soldering time or high soldering temperature results in
leaching of the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage in the
components, preheating shoud be required for the both
components and the PCB board. Preheating conditions
are shown in Table 2. It is required to keep temperature
differential between the soldering and the components
surface ($T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
Table 2
Part Number
GRM18/21/31
LLL21/31
ERB18/21
ERB18/21
GQM18/21
Temperature Differential
$T-150%
Recommended Conditions
Pb-Sn Solder
Peak Temperature
240-250oC
Atmosphere
Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Lead Free Solder
250-260oC
N2
Optimum Solder Amount for Flow Soldering
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Standard Conditions for Flow Soldering
Temperature (%)
Peak Temperature
Soldering
Gradual
Cooling
$T
170oC
150oC
130oC
Preheating
Time
60-120 seconds 5 seconds max.
Allowable Soldering Temperature and Time
280
270
260
250
240
230
220
0
10
20
30
40
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
13
Adhesive
Up to Chip Thickness
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