ERB1885C2E100GDX5D Datasheet, PDF (16/20 Pages) Murata Manufacturing Co., Ltd. – Application Spec ifi c Capacitors High Frequency Ceramic Capacitors

A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors _{C020E7..2p.d6f Note}
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ERB_CS_ao_ul_td_ioe_nring and Mounting
Continued from the preceding page.
3. Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in Table 1. It is required to
keep temperature differential between the soldering and
the components surface ($T) as small as possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile where
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
termination chip before use.
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ($T)
between the component and solvent within the range
shown in the Table 1.
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Table 1
Part Number
GRM02/03/15/18/21/31
GJM03/15
LLLE1R5/B1188/2/12/131
ERB18/21
GQM18/21
GRM32/43/55
LLA18/21/31
LLME2R1/B3312
GNM
ERB32
Temperature Differential
$T-190%
$T-130%
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230-250oC 230-240oC
240-260oC
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Standard Conditions for Reflow Soldering
Infrared Reflow
Temperature (%)
Peak Temperature
200oC
$T
170oC
150oC
130oC
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 30-60 seconds
Temperature (%)
Peak Temperature
Vapor Reflow
$T
170oC
150oC
130oC
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 20 seconds max.
Allowable Soldering Temperature and Time
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
cracked chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
Optimum Solder Amount for Reflow Soldering
0.2mm min.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
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C-29-C
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