English
Language : 

ERB1885C2E100GDX5D Datasheet, PDF (15/20 Pages) Murata Manufacturing Co., Ltd. – Application Spec ifi c Capacitors High Frequency Ceramic Capacitors
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors C02E.pdf !Note ï Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uintítsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
sales repres•enTthaistivceastaolor gprhoadsucotnelyntgyipniecearlsspbeecfoifriceaotirodnesribnegc. ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
07.2.6 ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ERB Soldering and Mounting
!Caution
■ !Caution (Soldering and Mounting)
1. Mounting Position
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
Component Direction
Locate chip
horizontal to the
direction in
which stress
acts
Chip Mounting Close to Board Separation Point
Perforation
C
B
Chip arrangement
Worst A-C-(B~D) Best
D
A
Slit
2. Chip Placing
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
Incorrect
Suction Nozzle
Correct
Board
Deflection
Board Guide
13
Support Pin
Continued on the following page.
58 – Innovator in Electronics

www.murata.com

83
C-29-C