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CM1000E4C-66R Datasheet, PDF (3/8 Pages) Mitsubishi Electric Semiconductor – HVIGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE | |||
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4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
MITSUBISHI HVIGBT MODULES
CM1000E4C-66R
HIGH POWER SWITCHING USE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS (continuation)
Symbol
Item
Reverse recovery time
trr
(Note 2)
Irr
Qrr
Erec(10%)
Reverse recovery current
(Note 2)
Reverse recovery charge
(Note 2)
Reverse recovery energy
(Note 2)(Note 5)
VCC = 1800 V
IC = 1000 A
VGE = ±15 V
RG(on) = 2.4 â¦
Ls = 150 nH
Inductive load
Erec
Reverse recovery energy
(Note 2)(Note 6)
Conditions
Tj = 25°C
Tj = 125°C
Tj = 150°C
Tj = 25°C
Tj = 125°C
Tj = 150°C
Tj = 25°C
Tj = 125°C
Tj = 150°C
Tj = 25°C
Tj = 125°C
Tj = 150°C
Tj = 25°C
Tj = 125°C
Tj = 150°C
Limits
Min
Typ
Unit
Max
â
0.50
â
â
0.70
â
µs
â
0.80
â
â
850
â
â
1000
â
A
â
1050
â
â
700
â
â
1150
â
µC
â
1350
â
â
0.70
â
â
1.20
â
J/P
â
1.35
â
â
0.80
â
â
1.35
â
J/P
â
1.55
â
THERMAL CHARACTERISTICS
Symbol
Item
Rth(j-c)Q Thermal resistance
Rth(j-c)R Thermal resistance
Rth(c-f) Contact thermal resistance
Conditions
Junction to Case, IGBT part
Junction to Case, FWDi part
Junction to Case, Clamp-Di part
Case to Fin, λgrease = 1W/m·K ,D(c-f) = 100 µm
Limits
Unit
Min
Typ
Max
â
â
12.0 K/kW
â
â
22.5 K/kW
â
â
22.5 K/kW
â
7.0
â K/kW
MECHANICAL CHARACTERISTICS
Symbol
Item
Mt
Ms
Mounting torque
Mt
m
Mass
CTI
Comparative tracking index
da
Clearance
ds
Creepage distance
LP CE
Parasitic stray inductance
RCCâ+EEâ Internal lead resistance
rg
Internal gate resistor
Conditions
M8: Main terminals screw
M6: Mounting screw
M4: Auxiliary terminals screw
Collector to Emitter
Anode to Cathode
Tc = 25°C, Collector to Emitter
Tc = 25°C, Anode to Cathode
Tc = 25°C
Limits
Unit
Min
Typ
Max
7.0
â
22.0 N·m
3.0
â
6.0 N·m
1.0
â
3.0 N·m
â
1.2
â
kg
600
â
â
â
19.5
â
â
mm
32.0
â
â
mm
â
22.0
â
nH
â
33.0
â
nH
â
0.24
â
mâ¦
â
0.36
â
mâ¦
â
2.25
â
â¦
Note 1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Topmax rating (150°C).
2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi) and the brake chopper, anode to cathode
clamp diode (Clamp-Di).
3. Junction temperature (Tj) should not exceed Tjmax rating (150°C).
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
5. Eon(10%) / Eoff(10%) / Erec(10%) are the integral of 0.1VCE x 0.1IC x dt.
6. The integration range of Eon / Eoff / Erec according to IEC 60747.
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
3
Mar. 2009
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