MYX4DDR264M16HW Datasheet, PDF (42/51 Pages) –

1Gb DDR2 SDRAM
MYX4DDR264M16HW*
*Advanced information. Subject to change without notice.
AC Characteristics
-25E
Parameter
Symbol
Min
Max
Average periodic refresh (automotive)
t_REFIAT
–
3.9
CKE LOW to CK, CK# uncertainty
t_{DELAY }
MIN limit = ^tIS + ^tCK + ^tIH; MAX limit = n/a
Self Refresh
Exit SELF REFRESH to onREAD command
t_XSNR
MIN limit = ^tRFC (MIN) + 10; MAX limit = n/a
Exit SELF REFRESH to READ command
t_XSRD
MIN limit = 200; MAX limit = n/a
Exit SELF REFRESH timing reference
t_ISXR
MIN limit = ^tIS; MAX limit = n/a
Power Down
MR12 = 0 ^tXARD
2
–
Exit active power- down to READ command
MR12 = 1
8 - AL
–
Exit precharge power-down and active power-down to any
nonREAD command
t_XP
2
–
CKE MIN HIGH/LOW time
t_CKE
MIN = 3; MAX = n/a
ODT
ODT to power- down entry latency
t_ANPD
3
–
ODT power-down exit latency
t_AXPD
8
–
ODT turn-on delay
t_AOND
2
ODT turn-off delay
t_AOFD
2.5
ODT turn-on
t_AON
t_{AC (MIN)}
t_{AC (MAX) +600}
ODT turn-off
t_AOF
MIN = ^tAC (MIN); MAX = ^tAC (MAX) + 600
ODT turn-on (power-down mode)
t_AONPD
t_{AC (MIN) + 2000}
2 × ^tCK + ^tAC (MAX) + 1000
ODT turn-off (power-down mode)
t_AOFPD
MIN = ^tAC (MIN) + 2000; MAX = 2.5 × ^tCK + ^tAC (MAX) + 1000
ODT enable from MRS command
t_MOD
MIN = 12; MAX = n/a
Units Notes
μs 18, 41
ns
42
ns
t_CK
18
ps 33, 43
t_CK
t_CK
18
t_CK
t_{CK 18, 44}
t_CK
t_CK
18
t_CK
t_{CK 18, 45}
ps 19, 46
ps 47, 48
ps
49
ps
ns 18, 50
Notes:
1. All voltages are referenced to V_SS.
2. Tests for AC timing, I_DD, and electrical AC and DC characteristics may be conducted at nominal reference/
supply voltage levels, but the related specifications and the operation of the device are warranted for the
full voltage range specified. ODT is disabled for all measurements that are not ODT-specific.
3. Outputs measured with equivalent load.
4. AC timing and I_DD tests may use a V_IL-to-V_IH swing of up to 1.0V in the test environment, and parameter
specifications are guaranteed for the specified AC input levels under normal use conditions. The slew rate
for the input signals used to test the device is 1.0 V/ns for signals in the range between V_IL(AC) and V_IH(AC).
Slew rates other than 1.0 V/ns may require the timing parameters to be derated as specified.
MYX4DDR264M16HW*
Revision 1.4 - 03/29/2016
42
Form #: CSI-D-685 Document 005