MT47H64M16HR-25ELH Datasheet, PDF (19/132 Pages) Micron Technology – 1Gb: x4, x8, x16 DDR2 SDRAM

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
0.155
1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Seating plane
1.8 CTR
A
Nonconductive
overmold
0.12 A
84X Ø0.45
Dimensions apply
to solder balls
post-reflow on
Ø0.35 SMD ball pads.
987
12.5 ±0.1
11.2 CTR
0.8 TYP
321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
Ball A1 ID
0.8 TYP
1.1 ±0.1
6.4 CTR
8 ±0.1
0.25 MIN
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. X 10/11 EN
19
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