MT47H32M16CC3B Datasheet, PDF (19/133 Pages) Micron Technology – 512Mb: x4, x8, x16 DDR2 SDRAM

512Mb: x4, x8, x16 DDR2 SDRAM
Packaging
Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8
0.8 ±0.05
0.155
Seating
Plane
0.12 A
A
1.8 CTR
Nonconductive overmold
60X Ø0.45
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow 9 8 7
on Ø0.35 SMD ball
pads.
8 CTR
0.8 TYP
321
Ball A1 ID
A
B
C
D
E
F 10 ±0.1
G
H
J
K
L
Ball A1 ID
0.8 TYP
6.4 CTR
1.2 MAX
0.25 MIN
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
19
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