MT47H32M16CC3B Datasheet, PDF (1/133 Pages) Micron Technology – 512Mb: x4, x8, x16 DDR2 SDRAM

512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
• V_DD = 1.8V ±0.1V, V_DDQ = 1.8V ±0.1V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 4 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1 ^tCK
• Selectable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• Automotive temperature (AT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
Options¹
Marking
• Configuration
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
128M4
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
64M8
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
32M16
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G HR
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
CF
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G HW
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
JN
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
-187E
– 2.5ns @ CL = 5 (DDR2-800)
-25E
– 2.5ns @ CL = 6 (DDR2-800)
-25
– 3.0ns @ CL = 4 (DDR2-667)
-3E
– 3.0ns @ CL = 5 (DDR2-667)
-3
– 3.75ns @ CL = 4 (DDR2-533)
-37E
• Self refresh
– Standard
None
– Low-power
L
• Operating temperature
– Commercial (0°C ≤ T_C ≤ +85°C)
– Industrial (–40°C ≤ T_C ≤ +95°C;
–40°C ≤ T_A ≤ +85°C)
– Automotive (–40°C ≤ T_C, T_A ≤ +105°C)
• Revision
None
IT
AT
:F/:G
Note:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.