PC28F00BP30EFA Datasheet, PDF (10/86 Pages) Micron Technology – Numonyx® Axcell™ P30-65nm Flash Memory

P30-65nm
Table 2: TSOP Package Dimensions (Sheet 2 of 2)
Product Information
Symbol
Min
Millimeters
Nom
Max
Min
Inches
Nom
Lead Count
N
-
56
-
-
56
Lead Tip Angle
θ
0°
3°
5°
0°
3°
Seating Plane Coplanarity
Y
-
-
0.100
-
-
Lead to Package Offset
Z
0.150
0.250
0.350
0.006
0.010
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Max
-
5°
0.004
0.014
2.2
64-Ball Easy BGA Package (512-Mbit, 1-Gbit, 2-Gbit)
Figure 4: Easy BGA Mechanical Specifications (8x10x1.2 mm)
Ball A1
Corner
D
12 345 67 8
A
B
C
D
E
E
F
G
H
Top View - Ball side down
S1
Ball A1
Corner
87 6 543 2 1
S2
A
B
C
D
b
E
F
G
e
H
Bottom View - Ball Side Up
A1
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Table 3: Easy BGA Package Dimensions for 8x10x1.2 mm (Sheet 1 of 2)
Product Information
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Symbol
A
A1
A2
b
D
Millimeters
Min
-
0.250
-
0.330
9.900
Nom
-
-
0.780
0.430
10.000
Max
1.200
-
-
0.530
10.100
Min
-
0.0098
-
0.0130
0.3898
Inches
Nom
-
-
0.0307
0.0169
0.3937
Max
0.0472
-
-
0.0209
0.3976
Datasheet
10
Sept 2012
Order Number: 208042-06