TC1302A_13 Datasheet, PDF (3/26 Pages) Microchip Technology – Low Quiescent Current Dual Output LDO

TC1302A/B
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V_DD................................................................................... 6.5V
Maximum Voltage on Any Pin ...... (V_SS – 0.3) to (V_IN + 0.3)V
Power Dissipation ..........................Internally Limited (Note 7)
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, T_J ........................... +150°C
Continuous Operating Temperature Range ..-40°C to +125°C
ESD protection on all pins, HBM, MM 4 kV, 400V
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, V_IN = V_R +1V, I_OUT1 = I_OUT2 = 100 µA, C_IN = 4.7 µF,
C_OUT1 = C_OUT2 = 1 µF, C_BYPASS = 10 nF, SHDN > V_IH, T_A = +25°C.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ Max Units
Conditions
Input Operating Voltage
Maximum Output Current
Maximum Output Current
Output Voltage Tolerance
(V_OUT1 and V_OUT2)
Temperature Coefficient
(V_OUT1 and V_OUT2)
Line Regulation
(V_OUT1 and V_OUT2)
Load Regulation, V_OUT  2.5V
(V_OUT1 and V_OUT2)
Load Regulation, V_OUT < 2.5V
(V_OUT1 and V_OUT2)
Thermal Regulation
Dropout Voltage (Note 6)
V_IN
2.7
—
6.0
V Note 1
I_OUT1Max
300
—
—
mA V_IN = 2.7V to 6.0V (Note 1)
I_OUT2Max
150
—
—
mA V_IN = 2.7V to 6.0V (Note 1)
V_OUT
V_R – 2.5 V_R±0.5 V_R + 2.5
%
Note 2
TCV_OUT
—
25
— ppm/°C Note 3
V_OUT/V_IN
—
0.02
0.2
%/V (V_R + 1V)  V_IN  6V
V_OUT
-1
V_OUT
V_OUT
-1.5
V_OUT
V_OUT/P_D
—
0.1
+1
0.1
+1.5
0.04
—
%
I_OUTX = 0.1 mA to I_OUTMax, (Note 4)
%
I_OUTX = 0.1 mA to I_OUTMax, (Note 4)
%/W Note 5
V_OUT1 > 2.7V
V_OUT2 > 2.6V
Supply Current
V_IN – V_OUT
—
V_IN – V_OUT
—
104
180
150
250
mV I_OUT1 = 300 mA
mV I_OUT2 = 150 mA
TC1302A
I_IN(A)
—
103
180
µA SHDN2 = V_IN, I_OUT1 = I_OUT2 = 0 mA
TC1302B
I_IN(B)
—
114
180
µA SHDN1 = SHDN2 = V_IN,
I_OUT1 = I_OUT2 = 0 mA
Note 1:
2:
3:
4:
The minimum V_IN has to meet two conditions: V_IN  2.7V and V_IN  V_R + V_DROPOUT.
V_R is defined as the higher of the two regulator nominal output voltages (V_OUT1 or V_OUT2).
TCV_OUT = ((V_OUTmax - V_OUTmin) * 10⁶)/(V_OUT * T).
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAX at V_IN = 6V for t = 10 msec.
6: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
value measured at a 1V differential.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
 2003-2012 Microchip Technology Inc.
DS21333C-page 3